Haedo Jeong received B.S. degree from Pusan National University, Korea in 1987 and the M.S. degree and Ph.D. in mechanical engineering from KAIST, Korea in 1989 and from University of Tokyo, Japan in 1994, respectively. His PhD thesis was "A study on planarization of device wafer using abrasive process"as a first thesis in the world. From 1989 to 1991, he worked at government research institutes of KIST and KITECH, where he was responsible for abrasive machining process such as grinding and polishing. In 1994, he joined at Japanese government project with RIKEN and Fujikoshi machinery, Japan as a post-doc. researcher to develop a CMP equipment.
From 1995, he is working as a professor in the school of mechanical engineering as well as a director of CMP laboratory at Pusan National University which is one of three major universities in Korea CMP field. He has also served as a director of LINC (Leaders in INdustry-university Cooperation) government project for 4 years from 2013. His research interests include wafering processes, chemical mechanical polishing and its post cleaning. He has authored in more than 600 technical publications/presentations in the area of CMP including 148 SCI papers and 120 Korean papers. He is an emeritus president of Korea CMPUGM and an executive committee member of International Conference on Planarization/CMP Technology (ICPT) which is the largest CMP conference in the world. He is also a founder and president of G&P Technology which is one of the strongest R&D CMP tool suppliers with more than 200 sales record, founded in 1999.
He served as a president of Korean Society of Precision Engineering (KSPE) in 2019 and an co-editor-in-chief of international journal of precision engineering and manufacturing - green technology (IJPEM-GT) for recent 5 years. Thanks to his contribution, he got many awards and medals from 30 different organizations including government. He may be reached at 82-51-510-2463 or by email hdjeong@pusan.ac.kr.

Da-Jeng Yao received his Ph.D. from Department of Mechanical and Aerospace Engineering, University of California at Los Angeles (UCLA) in 2001. After joining National Tsing Hua University, his research focused on fertilization on a chip, intelligent gas sensing system, EWOD and digital microfluidic system, and Tera Hertz system development. There are more than 100 multidisciplinary projects running or completed under his research team with other organizations (NTHU LS, CHEM, EE, PME, NEMS, and ESS, NTU ME, NCTU ME, Chang-Gung Hospital, and ITRI, etc.). More than 100 journal papers were published at top journal among this research field, including Biosensors and Bioelectronics, Biomicrofludics, Nanotechnology, Applied Energy, Journal of Micromechanics and Microengineering, and Lap on a chip, etc.

On Aug. 2021, he was invited to serve as General Director of Mechanical and Mechatronics System Lab (MMSL) at Industrial Technology Research Institute, Taiwan. The goal of institute is going to conduct and develop advanced research for industries, involving smart and green manufacturing, Autonomous and electronic car (EV), Robotics, Drone, Railway systems, and Aerospace industry.

He got Wu-Da-Yu Memorial Award (Young Investigator) from National Science Council in 2009, Shen-Yin award in 2010, and Young Researcher from Society of Theoretical and Applied Mechanics of the Republic of China in 2011, National Innovation Award in 2012 and in 2014, 2nd prize of Xprize (US10M award) by Qualcomm with HTC team in 2017, MOST excellent research award in 2020, Excellent Engineering Professor Award from Chinese Society of Mechanical Engineers (CSME) in 2021, and 2022 Gold medal of excellent research award from ITRI. He was awarded as ASME fellow since 2013, and RSC fellow since 2018.